Great Lakes Semiconductor

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Our Plan

The Facilities

Markham “Chip Forge”

Phase 1a – Pocket Fab (“ChipForge”). In collaboration with our Japanese partners, GLS will establish North America’s first fully functional prototype/small lot production facility for essential node (.18m to 28n) devices. Key features of the Pocket Fab are:

  1. Up to 30,000 sq. ft. of Class 1000 cleanroom space
  2. 2 -inch wafer size
  3. Production time < 10 days
  4. No photomask required
  5. Full capabilities including CMOS and NMOS & image sensor
  6. Capable of essential node prototype and production
  7. Automated
  8. New FOUP Transfer system

Pickering Great Lakes Technology Park

Phase 1b – Initial Class 1 Clean Room/200mm Chip (“Hyperion”) Fabrication Facility.

  1. Initial Cleanroom Size: 100,000 square feet (plan would be to expand by 50,000sqft increments based on out-take commitments)
  2. Wafer Diameter: 200mm
  3. Production nodes: 118n, 110n, 90nm, 60nm, 45nm, 32nm, and 28nm
  4. Core initial production focus: volume production of MEMS and sensor chips•
  5. Initial site area: 40-100 acres – includes cleanroom space, support facilities, parking, and utility buildings
  6. Estimated production will be 25,000-40,000 – 8-inch wafers per month

The Product

Our semiconductor product plan leverages cutting-edge ferroelectric materials to develop innovative products tailored to the automotive industry. The initial focus is on ferroelectric RAM (FeRAM), offering low-power, high-speed, and durable memory solutions for automotive control systems and IoT-enabled devices. By partnering with a memory company, we aim to accelerate foundry setup and design, building a foundation for integrating advanced ferroelectrics into power-efficient IoT sensors. These sensors will monitor critical vehicle parameters like tire pressure, vibration, brake wear, tread depth, internal air quality, and temperature while utilizing proprietary low-power radio technology for reliable data transmission, even in challenging environments. Our software will focus on ioT and failure predictability. Our long-term vision enables us to develop flexible, battery-free devices that combine energy storage, harvesting, sensing, and communication into a single robust package, ensuring extended operational life and alignment with green initiatives. This plan is linear and allows us to add innovation as it becomes available and still offers measurable benefits at each released stage.

Future planned advancements will focus on flexible circuit design and ferroelectrics to enable smart materials to enable new patented/trade secret protected inventions for attaching sensors to devices without impacting the device. Further, moving forward from energy storage, energy harvesting solutions, leveraging ferroelectrics’ piezoelectric and pyroelectric properties, will power our IoT devices sustainably, reducing reliance on existing battery technologies such as lithium-ion batteries.

Integration with advanced packaging and miniaturization techniques will enhance our current sensors, tire pressure monitoring system (TPMS), brake wear, wheel off, etc. by integrating into chip-scale solutions, broadening their application across fleets while lowering their costs. By integrating sensing, storage, and wireless communication into cohesive, flexible systems, we aim to lead in delivering cost-effective, environmentally friendly, and highly functional solutions for next-generation automotive applications.